TLPS

Transient Liquid Phase Soldering (TLPS) preforms utilize a unique composite structure, using the same processes and equipment as conventional soft solder to create lead-free solder joints with a high melting point (>400°C). Their soldering reliability rivals that of silver sintering. TLPS preforms offer low cost and high-temperature resistance, resolving the industry's pain points with high-temperature interconnect materials and are the best choice for leading customers.

Advantages of TLPS preforms:

1. Lower soldering temperature, minimizing damage to micro-components and reducing thermal stress on hybrid joints;
2. Offer higher reliability than soft solder and comparable reliability to silver sintering;
3. Compatible with lead-free soldering;
4. No flux required;
5. The solder joint is a high-melting-point intermetallic compound, allowing for a higher service temperature.