Solder Preforms and Ribbons

Highly customized alloy components and specifications meet various high-demand soldering scenarios and provide high-quality soldering results

Ribbons

Preforms

High-cleanliness preforms and ribbons are high-quality solder material produced through meticulous processing in a dust-free environment, making them particularly suitable for semiconductor vacuum soldering processes.This process replaces the flux used in traditional processes with an N2+H2 (forming gas) HCOOH atmosphere. In a vacuum reflow oven, H2 or HCOOH is used to reduce the oxide layers of the solder and the surfaces to be soldered, thereby promoting the wetting of the solder to the surface to be soldered. Circulating vacuum is then used to eliminate voids caused by water vapor generated during the oxide film removal process, thereby achieving a high-quality surface with ultra-low void rate. Compared to other common solder materials, high- cleanliness purity solder preforms and ribbons are high-quality materials, resulting from carefully selected raw materials and meticulous processing. They offer advantages such as precise composition (compliant with J-STD-006 solder alloy composition and testing standards), thin oxide film, high cleanliness, and excellent solderability. In addition, their form is customized to the dimensions of the components being soldered, making them easy to install between components. Furthermore, high-cleanliness purity solder preforms can combine with solder paste to achieve increased solder volume.

Solder Ribbon: Ribbons have a rectangular cross-section. We offer custom ribbon thicknesses ranging from 0.04-5mm and widths from 0.8-120mm. The ribbon is packaged on custom reels for easy installation on the machine in the client end.

Solder Preforms: Preforms are produced according to clients’ drawings. Their shapes can be customized to rectangular, square, disc, ring, or special shapes (such as small holes on rectangular preforms) according to client requirements to better fit the shape of the soldering device itself and ensure high soldering reliability.

We support various solder packaging options, providing packaging tailored to suit the solder shape and customer assembly requirements. Ribbons are packaged in reels, with reel dimensions determined by the solder size. The inner hole size and flange size can be customized to meet the customer's automated assembly requirements.

Lead-free Solder

Multi-alloy Solder

SAC305 Ribbons

SnCu7 Ribbons

SnSb8 Preforms

高铅焊带

高铅焊片

SnAgCuSb Ribbons

Key Features: