BSD R&D Center, with its strong R&D team, advanced equipment and technology, and world-leading application systems, has become a core force in China's semiconductor soldering industry. Through continuous technological innovation and international expansion, the center will inject strong impetus into the industry's high-quality development, promoting both technological innovation and industrial development.
BSD R&D Center, equipped with industry-leading intelligent R&D/production equipment and a professional laboratory compliant with CNAS standards, comprehensively masters key technologies in chip soldering, substrate soldering, and semiconductor packaging, and is a world leader in high-reliability solder paste, solder preforms, and composite solder materials.
